{"id":158,"date":"2016-02-18T10:49:08","date_gmt":"2016-02-18T09:49:08","guid":{"rendered":"http:\/\/www.icmm.csic.es\/ecit2\/?page_id=158"},"modified":"2016-02-18T10:49:08","modified_gmt":"2016-02-18T09:49:08","slug":"transfer","status":"publish","type":"page","link":"https:\/\/wp.icmm.csic.es\/eosmad\/transfer\/","title":{"rendered":"Tech Transfer"},"content":{"rendered":"<h3><span style=\"color: #0da4d3\"><strong>Fabrication of thin films for microelectronics and flexible electronics<\/strong><\/span><\/h3>\n<p><span style=\"color: #000000\">Our group has developed a <strong>groundbreaking key enabling technology<\/strong><sup>1<\/sup>&nbsp;aimed at the&nbsp;direct fabrication of functional inorganic thin&nbsp;films on flexible polymeric substrates&nbsp;for a new generation of large area, flexible electronic devices,&nbsp;with a wide range of&nbsp;applications&nbsp;as sensors, transducers,&nbsp;actuators and memories. This technology is based on low cost, highly efficient, advanced chemical solution deposition methods,&nbsp;which has allowed us lowering the processing temperatures&nbsp;(&lt; 350<sup>0<\/sup>C) of a wide range of metallic oxides \u2014 <em>dielectrics,&nbsp;ferroelectrics, multiferroics&nbsp;and (semi)conductors<\/em> \u2014 and, thus, the deposition on&nbsp;low termal stability substrates, such as plastics and glasses. This technology is also proven on conventional&nbsp;semiconductor substrates&nbsp;tradicionally used in microelectronics.<\/span><\/p>\n<p><sup>1 <\/sup>&#8220;<span class=\"tituloActividad\">Method for the preparation at low temperaturas of ferroelectric thin films by diphasic precursors and photochemical solution deposition, and their applications on non-refractory substrates&#8221;<\/span> <strong>International Patent PCT\/IB2009\/055699<\/strong> (2009). Extended to USA, Japan, and Korea in 2012.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-498\" src=\"https:\/\/wp.icmm.csic.es\/eosmad\/wp-content\/uploads\/sites\/31\/2016\/07\/tech-transfer_flexible.png\" alt=\"tech transfer_flexible\" width=\"200\" height=\"148\" srcset=\"https:\/\/wp.icmm.csic.es\/eosmad\/wp-content\/uploads\/sites\/31\/2016\/07\/tech-transfer_flexible.png 479w, https:\/\/wp.icmm.csic.es\/eosmad\/wp-content\/uploads\/sites\/31\/2016\/07\/tech-transfer_flexible-300x222.png 300w\" sizes=\"auto, (max-width: 200px) 100vw, 200px\" \/><\/p>\n<p>Contact person:<strong> <a href=\"mailto:lcalzada@icmm.csic.es\" target=\"_blank\">M.L. Calzada<\/a><\/strong><\/p>\n<hr>\n<h3>&nbsp;<\/h3>\n<h3><span style=\"color: #0da4d3\"><strong>Development of advanced electroceramics&nbsp;for piezoelectric&nbsp;and magnetoelectric applications<\/strong><\/span><\/h3>\n<p>Our group has ample experience in the synthesis of functional oxides and the processing of&nbsp;ceramic materials for applications, using&nbsp;both conventional&nbsp;and advanced methods. This, together with our expertise and full equipped facilities for their functional characterization, make us fully capable of facing the challenge of&nbsp;<strong>developing new electroceramics with tailored properties<\/strong><sup>1,2<\/sup>. The final objective&nbsp;is always to transfer these materials to new and improved high technology products. Recent examples of our activity in this field are&nbsp;piezoelectric ceramics with high sensittivity and ready&nbsp;for operation in extreme conditions, and improved magnetoelectric ceramic&nbsp;composites for energy harvesting.<\/p>\n<p><sup>1 <\/sup>&#8220;<span class=\"tituloActividad\">A high temperature piezoelectric BiScO3-PbTiO3 ceramic material chemically engineered for enhanced voltage response, and a procedure for obtaining said ceramic material<\/span><span class=\"tituloActividad\">&#8220;<\/span> <strong>International Patent PCT\/EP16\/082337<\/strong> (2016)<\/p>\n<p><sup>2 <\/sup>&#8220;<span class=\"tituloActividad\">A high temperature piezoelectric BiScO3-PbTiO3 ceramic material chemically engineered for<\/span> high power operation<span class=\"tituloActividad\">, and a procedure for obtaining said ceramic material&#8221;<\/span> <strong>International Patent PCT\/EP16\/082424<\/strong> (2016)<\/p>\n<p><span style=\"color: #0da4d3\"><strong><a href=\"http:\/\/documenta.wi.csic.es\/alfresco\/downloadpublic\/direct\/workspace\/SpacesStore\/95420876-7457-4763-b64c-8d56f551bac9\/Leaflet-MC-077-2016-10-27.pdf\" target=\"_blank\">download leaflet<\/a><br \/>\n<\/strong><\/span><\/p>\n<p>Contact person: <a href=\"mailto:malguero@icmm.csic.es\" target=\"_blank\"><strong>M. Alguer\u00f3<\/strong><\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Fabrication of thin films for microelectronics and flexible electronics Our group has developed a groundbreaking key enabling technology1&nbsp;aimed at the&nbsp;direct fabrication of functional inorganic thin&nbsp;films&#8230;<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"page-template-fullwidth.php","meta":{"ngg_post_thumbnail":0,"footnotes":""},"class_list":["post-158","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/wp.icmm.csic.es\/eosmad\/wp-json\/wp\/v2\/pages\/158","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/wp.icmm.csic.es\/eosmad\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/wp.icmm.csic.es\/eosmad\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/wp.icmm.csic.es\/eosmad\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/wp.icmm.csic.es\/eosmad\/wp-json\/wp\/v2\/comments?post=158"}],"version-history":[{"count":0,"href":"https:\/\/wp.icmm.csic.es\/eosmad\/wp-json\/wp\/v2\/pages\/158\/revisions"}],"wp:attachment":[{"href":"https:\/\/wp.icmm.csic.es\/eosmad\/wp-json\/wp\/v2\/media?parent=158"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}