PVD Systems
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- Magnetron sputtering 1: 100 W DC, Base pressure: < 10-6 mbar, Trajectory generator for multilayer depositions, Ion gun for surface modification during growth.
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![th_sputtering1](https://wp.icmm.csic.es/surfcoat/wp-content/uploads/sites/45/2013/05/th_sputtering1.jpg) |
- Magnetron sputtering 2: Base pressure < 10-7 mbar, 2-cathode simultaneous co-sputtering, Pulsed sources , In-situ optical measurements (ellipsometry) , load lock accessory.
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![th_sputtering2](https://wp.icmm.csic.es/surfcoat/wp-content/uploads/sites/45/2013/05/th_sputtering2.jpg) |
- Magnetron sputtering 3: Base pressure < 10-7 mbar, 3-cathode simultaneous co-sputtering, Rotating holder for deposition under variable angles , load lock accessory (in preparation).
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![th_sputtering3](https://wp.icmm.csic.es/surfcoat/wp-content/uploads/sites/45/2013/05/th_sputtering3.jpg) |
- IBAD: (Nacho J/Nacho C/Jose)
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![th_ibad](https://wp.icmm.csic.es/surfcoat/wp-content/uploads/sites/45/2013/05/th_ibad.jpg) |
- Pulsed Filtered Cathodic Arc System: Highly ionized plasma and high arc currents (1×1011 A/m2) operating in pulsed mode. Plasma genetared by a triple cathode minigun and guided through a macroparticle 90o filter .
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![th_pulsed_arc](https://wp.icmm.csic.es/surfcoat/wp-content/uploads/sites/45/2013/05/th_pulsed_arc.jpg) |